Introduction to Basic Knowledge: "Electrolytic Nickel and Gold Plating"
Electroplating that makes thickness creation easy. Introducing the process and features. Company brochure available.
"Electrolytic plating" is a method that reduces metal ions through an electrolysis reaction and deposits metal onto the surface of a conductive material at the cathode. The areas that require plating must be connected by lead wires or patterns. When gold plating on copper, it is common to apply a nickel plating as a base layer because gold tends to diffuse into the copper over time. Typically, a thickness of about 3μm is secured. [Features] ■ Easier to increase thickness compared to electroless plating ■ Tends to be thicker on the outer side of the substrate and thinner in the center ■ Hardness is generally high *For more details, please download the PDF or contact us.
- 企業：アベソルダー
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